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注意：對于高溫操作，用戶必須進(jìn)行類似的測量和計(jì)算，以確定特定環(huán)境中存在的操作裕度。以下是用戶可以采取的一些步驟，以幫助實(shí)現(xiàn)升高溫度操作：1。將電路板放置在機(jī)箱中，使電路板組件側(cè)的氣流達(dá)到大。2、避免在附近放置高功耗板。僅使用低功耗IP模塊。IP模塊的位置是位置a（J2和J3）和位置d（J18和J19）。FCC合規(guī)性在沒有使用符合FCC的底盤的情況下進(jìn)行了測試，符合A類設(shè)備的要求。FCC合規(guī)性是在以下條件下實(shí)現(xiàn)的：1。所有外部輸入/輸出端口上的屏蔽電纜。電纜屏蔽通過連接到導(dǎo)電模塊前面板的金屬外殼連接器連接到接地。3、導(dǎo)電底盤導(dǎo)軌接地。這提供了將屏蔽連接到接地的路徑。前面板螺釘正確擰緊。對于低射頻發(fā)射，必須滿足上述條件。否則，可能會(huì)影響包含模塊的設(shè)備的FCC合規(guī)性。

Caution For elevated-temperature operation, the user must perform similar measurements and calculations to determine what operating margin exists in a specific environment. The following are some steps that the user can take to help make elevatedtemperature operation possible: 1. Position the board in the chassis for maximum airflow over the component side of the board. 2. Avoid placing boards with high power dissipation adjacent to the . Use low-power IP modules only. The preferred locations for IP modules are position a (J2 and J3) and position d (J18 and J19). FCC Compliance The was tested without IndustryPacks in an FCC-compliant chassis and meets the requirements for Class A equipment. FCC compliance was achieved under the following conditions: 1. Shielded cables on all external I/O ports. 2. Cable shields connected to earth ground via metal shell connectors bonded to a conductive module front panel. 3. Conductive chassis rails connected to earth ground. This provides the path for connecting shields to earth ground. 4. Front panel screws properly tightened. For minimum RF emissions, it is essential that the conditions above be implemented. Failure to do so could compromise the FCC compliance of the equipment containing the module.